| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a belt for transporting strip-like components, with which the defective rate of plated products is reduced. <P>SOLUTION: In an automated inline step such as a plating step in the steps for manufacturing semiconductors or other components in large quantity, the belt for transporting strip-like components is configured in such a manner that fingers 30 are bonded at a fixed pitch interval to a belt body 10 and used to transport the strip-like components 50 in such a state that each strip-like component 50 is gripped between the belt body 10 and each finger; gripping projection parts 12 for gripping the strip-like components 50 are extendingly formed at a fixed pitch interval on one side of the belt body, and a recessed part 14 is formed between one gripping projection part and the gripping projection part adjacent to this gripping projection part; and an installation long hole 16, into which a gripping tip part 32 of each finger is fitted to be attached, is provided at the rear part of the center of each gripping projection part; and when the finger is attached, the gripping tip part 32 is located at the center of the gripping projection part, and the end part of the gripping tip part and the end part of the gripping projection part coincide with each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
