发明名称 Method For Manufacturing Wraparound Shield Write Head Using Hard Masks
摘要 The present disclosure describes a method for manufacturing a full wraparound shield damascene write head through the implementation of a three layered (tri-layered) hard mask. According to an embodiment of the invention, the various layers of hard mask are used for different purposes during the formation of a write head. The wraparound shield head of the present invention exhibits improved physical characteristics that further result in improved performance characteristics. Use of the hard mask layers according to the present invention allows for use of manufacturing processes that can be more closely controlled than those processes used in other processes. For example, smaller dimension lithographic techniques can be used. Also, reliance on certain CMP processes is not necessary where the use of CMP processes is not as well-controlled as deposition or lithographic techniques as is possible using the present invention.
申请公布号 US2013026131(A1) 申请公布日期 2013.01.31
申请号 US201113193520 申请日期 2011.07.28
申请人 HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.;HUANG SHIWEN;LIU FENGLIN;ZHONG QIPING;SHIN KYUSIK;CHEN YINGJIAN 发明人 HUANG SHIWEN;LIU FENGLIN;ZHONG QIPING;SHIN KYUSIK;CHEN YINGJIAN
分类号 G11B5/127 主分类号 G11B5/127
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