| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate sealing method using glass frit, which is high in productivity; to provide a substrate sealing method using the glass frit, which is also applicable for a substrate having a material with low heat resistance; to provide a sealing body having high airtightness, which is manufactured by such a method; to provide a light-emitting device having high productivity and high reliability; and to provide a method for manufacturing the light-emitting device. <P>SOLUTION: A heating layer containing a conductive material for generating heat by induction heating is formed so as to be overlapped in an area where a paste containing a frit material and binder is applied, or the conductive material which generates heat by the inducting heating is applied to the paste itself. Moreover, the paste is locally heated using the induction heating and the binder contained in the paste may be removed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
