| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a stacked-type semiconductor device that allows an easy connection test during installation and an easy failure analysis after shipment. <P>SOLUTION: A stacked-type semiconductor device includes a first semiconductor device 101 and a second semiconductor device 102 that are mounted on a mounting substrate 103. The first semiconductor device has a plurality of test electrodes 143 and test wiring 118 that connects between the test electrodes or the test electrode and a first semiconductor chip 111. The mounting substrate has mounting-substrate-side test electrodes 133 connected to the test electrode, and mounting-substrate-side test wiring 134 connecting between the mounting-substrate-side test electrodes. The test electrodes are sequentially connected in series to constitute a connection test path, and the test electrode located at one end of the connection test path is connected to a first chip test terminal 161 of the first semiconductor chip. A test signal inputted to the test electrode located at the other end of the connection test path is inputted to the first semiconductor chip via the connection test path. <P>COPYRIGHT: (C)2013,JPO&INPIT |
