HOT PLATE OF SEMICONDUCTOR MANUFACTURING APPARATUS

摘要

PURPOSE: A hot plate for a semiconductor manufacturing apparatus is provided to improve corrosion resistance and abrasion resistance by completely molding the surface of the hot plate with tungsten coating and HIP(hot isostatic pressing) processes. CONSTITUTION: A hot plate includes a holding stand(11) and a support stand(12). The hot plate is made of metal materials. The support stand is combined with the holding stand. A coating layer(30) wit a preset thickness is formed on the surface of the hot plate. The coating layer improves durability and reliability by improving the surface of the metal material.