| 发明名称 |
Method for optimized removal of wafer from electrostatic chuck |
| 摘要 |
Systems and methods for optimally dechucking a wafer from an electrostatic chuck are described. The force on a lift-pin mechanism is monitored and a dechuck voltage is determined based on the force. The wafer is dechucked at the determined dechuck voltage.
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| 申请公布号 |
US8363378(B2) |
申请公布日期 |
2013.01.29 |
| 申请号 |
US20090372664 |
申请日期 |
2009.02.17 |
| 申请人 |
INTEVAC, INC.;BLUCK TERRY;SAHIBUDEEN HIZAM;GRIMARD DENNIS |
发明人 |
BLUCK TERRY;SAHIBUDEEN HIZAM;GRIMARD DENNIS |
| 分类号 |
H01T23/00 |
主分类号 |
H01T23/00 |
| 代理机构 |
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