| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to raise the reliability of the connection of input/ output pads with a wiring circuit pattern even if an anisotropic conductive material, such as an anisotropic conductive film, is used for mounting a flip-chip system. SOLUTION: Input/pads, which are used as terminals and are not shown in the diagram, are formed on the side of one main surface 1a of a bare chip 1 and bumps 2a and 25 of a shape that the height H1 of the bumps 2a and 2b on the outer peripheral edge sides of the chip 1 is higher than the height H2 of the bumps 2a and 2b on the inside of the chip 1 are respectively formed on these pads. This bare chip 1 is placed on a wiring circuit pattern and an anisotropic conductive material consisting of a resin, in which conductive particles are dispersed, is distributed between at least the bumps 2a and 2b and the wiring circuit pattern to connect electrically the input/output pads on the chip 1 with the wiring circuit pattern. |
