发明名称 Verfahren und Verbund zum Bearbeiten bzw. Behandeln einer Mehrzahl von Leiterplatten sowie Verwendung hierfür
摘要 In a method for processing a plurality of printed circuit boards, comprising the following steps: providing a plurality of printed circuit boards, providing at least one frame element, for coupling to a plurality of printed circuit boards, coupling or the printed circuit boards to the at least one frame element, processing the printed circuit boards in the state coupled to the frame element, it is provided that printed circuit boards of different sizes and/or thicknesses and/or of different constructions are coupled to the at least one frame element to form a composite assembly and are subjected to further processing in the composite assembly formed by the printed circuit boards and the at least one frame element. Furthermore, a composite assembly for processing a plurality of printed circuit boards and also a use of such a method and composite assembly are provided.
申请公布号 DE112011100921(A5) 申请公布日期 2013.01.24
申请号 DE201111100921T 申请日期 2011.03.10
申请人 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG 发明人 VOCKENBERGER, CHRISTIAN;FREYDL, GERHARD
分类号 H05K3/00;H05K13/00 主分类号 H05K3/00
代理机构 代理人
主权项
地址