| 摘要 |
PURPOSE: A flip chip bonding method is provided to increase the transfer rat of data through the flip chip bump by increasing the bonding area in between the flip chip bump and the conductive ball. CONSTITUTION: A first flip chip bump and a zygote are provided. An uneven surface with inconsistent height is formed on the surface of the first flip chip bump as processing the surface of the first flip chip bump. The first flip chip bump and the zygote above are bonded electrically as it permits one of the supersonic waves or heat and pressure at the same time The zygote above is composed of an anisotropic conductive film including the conductive ball. Binding the first flip chip bump and the zygote make a contact of the flip chip bump and the conductive ball. |
