发明名称 METHODS AND APPARATUS FOR CONTROLLING POWER DISTRIBUTION IN SUBSTRATE PROCESSING SYSTEMS
摘要 Methods and apparatus for controlling power distribution in a substrate processing system are provided. In some embodiments, a substrate processing system including a process chamber having a substrate support and a processing region disposed above the substrate support; a first conduit disposed above the processing region to provide a portion of a first toroidal path that extends through the first conduit and across the processing region; a second conduit disposed above the processing region to provide a portion of a second toroidal path that extends through the second conduit and across the processing region; an RF generator coupled to the first and second conduits to provide RF energy having a first frequency to each of the first and second conduits; an impedance matching network disposed between the RF generator and the first and second conduits; and a power divider to control the amount of RF energy provided to the first and second conduits from the RF generator.
申请公布号 WO2013012562(A2) 申请公布日期 2013.01.24
申请号 WO2012US45496 申请日期 2012.07.05
申请人 APPLIED MATERIALS, INC.;LAI, CANFENG;ABERLE, DAVID, E.;KAMP, MICHAEL, P.;BARANDICA, HENRY;HILKENE, MARTIN, A.;SCOTNEY-CASTLE, MATTHEW, D.;TOBIN, JEFFREY;BURNS, DOUGLAS, H.;HAWRYLCHAK, LARA;PORSHNEV, PETER, I. 发明人 LAI, CANFENG;ABERLE, DAVID, E.;KAMP, MICHAEL, P.;BARANDICA, HENRY;HILKENE, MARTIN, A.;SCOTNEY-CASTLE, MATTHEW, D.;TOBIN, JEFFREY;BURNS, DOUGLAS, H.;HAWRYLCHAK, LARA;PORSHNEV, PETER, I.
分类号 H05H1/46;H01L21/3065;H03H7/40 主分类号 H05H1/46
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