| 摘要 |
PURPOSE: A printed circuit board and a method for manufacturing the same are provided to improve an adhesive force by forming a bonding area touching a conductive via through Sn plating. CONSTITUTION: An electric component(200) has at least two terminals. A via hole is formed in an insulating substrate. The via hole opens the terminal of the electric component. A conductivity absorption layer(150) has conductive particles absorbed to the side of the via hole. A conductive via is formed by burying the via hole.
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