PURPOSE: A lead pin for a printed circuit board(PCB) is provided to increase a touched area of the lead pin and solder by forming a head with more than three angles of structure, thereby improving bond strength between the lead pin and the printed circuit board and bond strength between the lead pin and a semiconductor device. CONSTITUTION: A lead pin for a PCB(100) includes a connection pin(120) and a pin head unit(110). The pin head unit is formed in one end of the connection pin. The pin head unit includes a plurality of protrusions(113) and a head(111). The plurality of protrusions is formed in the center of the one end of the connection pin.
申请公布号
KR20130009128(A)
申请公布日期
2013.01.23
申请号
KR20110070011
申请日期
2011.07.14
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
KIM, BYUNG HUN;PARK, HEE SOOK;LEE, KI TAEK;CHOI, JIN WON;JEONG, SUNG WON;LEE, GI SUB;LEE, DAE YOUNG