发明名称 Method of fabricating backside illuminated image sensor
摘要 A method for fabricating a backside illuminated image sensor is provided. An exemplary method can include providing a substrate having a front surface and a back surface; forming an alignment mark at the front surface of the substrate, wherein the alignment mark is detectable for alignment from the back surface; and processing the substrate from the back surface by performing registration from the back surface and using the alignment mark as a reference.
申请公布号 US8357561(B2) 申请公布日期 2013.01.22
申请号 US201113044407 申请日期 2011.03.09
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;FU SHIH-CHI;SHIAU GWO-YUH;YAO LIANG-LUNG;HSIEH YUAN-CHIH;SHIU FENG-JIA 发明人 FU SHIH-CHI;SHIAU GWO-YUH;YAO LIANG-LUNG;HSIEH YUAN-CHIH;SHIU FENG-JIA
分类号 H01L31/18;H01L21/71;H01L31/0232 主分类号 H01L31/18
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