发明名称 |
Method of fabricating backside illuminated image sensor |
摘要 |
A method for fabricating a backside illuminated image sensor is provided. An exemplary method can include providing a substrate having a front surface and a back surface; forming an alignment mark at the front surface of the substrate, wherein the alignment mark is detectable for alignment from the back surface; and processing the substrate from the back surface by performing registration from the back surface and using the alignment mark as a reference.
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申请公布号 |
US8357561(B2) |
申请公布日期 |
2013.01.22 |
申请号 |
US201113044407 |
申请日期 |
2011.03.09 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;FU SHIH-CHI;SHIAU GWO-YUH;YAO LIANG-LUNG;HSIEH YUAN-CHIH;SHIU FENG-JIA |
发明人 |
FU SHIH-CHI;SHIAU GWO-YUH;YAO LIANG-LUNG;HSIEH YUAN-CHIH;SHIU FENG-JIA |
分类号 |
H01L31/18;H01L21/71;H01L31/0232 |
主分类号 |
H01L31/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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