发明名称 BACKSIDE ILLUMINITED IMAGE SENSOR
摘要 <p>PURPOSE: A back illuminated image sensor is provided to apply minus voltage to the rear surface of a semiconductor layer and to prevent color mixing. CONSTITUTION: A semiconductor substrate(530) has the front surface and the rear surface. A light receiving element is formed in the semiconductor substrate. The light receiving element changes the light inputted to the rear surface of the semiconductor substrate into electricity. A semiconductor layer(560) is formed on the front surface of the semiconductor substrate. A second semiconductor layer(550) is formed on the rear surface of the semiconductor substrate. [Reference numerals] (AA) Rear surface; (BB) Front surface</p>
申请公布号 KR20130007901(A) 申请公布日期 2013.01.21
申请号 KR20110068550 申请日期 2011.07.11
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 AHN, JUNG CHAK
分类号 H01L27/146;H04N5/359 主分类号 H01L27/146
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