发明名称 |
BACKSIDE ILLUMINITED IMAGE SENSOR |
摘要 |
<p>PURPOSE: A back illuminated image sensor is provided to apply minus voltage to the rear surface of a semiconductor layer and to prevent color mixing. CONSTITUTION: A semiconductor substrate(530) has the front surface and the rear surface. A light receiving element is formed in the semiconductor substrate. The light receiving element changes the light inputted to the rear surface of the semiconductor substrate into electricity. A semiconductor layer(560) is formed on the front surface of the semiconductor substrate. A second semiconductor layer(550) is formed on the rear surface of the semiconductor substrate. [Reference numerals] (AA) Rear surface; (BB) Front surface</p> |
申请公布号 |
KR20130007901(A) |
申请公布日期 |
2013.01.21 |
申请号 |
KR20110068550 |
申请日期 |
2011.07.11 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
AHN, JUNG CHAK |
分类号 |
H01L27/146;H04N5/359 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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