SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE

摘要

PURPOSE: A semiconductor light emitting device package is provided to reduce a size thereof by integrating a rectification circuit and other driving circuits with a semiconductor substrate. CONSTITUTION: A substrate(12) includes a first main surface and a second main surface which face each other. A light source is arranged on the first main surface of the semiconductor substrate. A plurality of electrode pads(16) are arranged on the second main surface of the semiconductor substrate. A conductive via(15) is extended from the plurality of electrode pads. The semiconductor substrate passes through from the second main surface to the first main surface by the conductive via.