A stacked leaded array is provided wherein the stacked leaded array allows for increased packing density of electronic components. The stacked leaded array has a multiplicity of electronic components in a stacked array. Each electronic component comprises a first termination and a second termination. A multiplicity of first leads are provided wherein each first lead is in electrical contact with at least one first termination. Second leads are in electrical contact with second terminations.
申请公布号
US2013016488(A1)
申请公布日期
2013.01.17
申请号
US201213533283
申请日期
2012.06.26
申请人
KEMET ELECTRONICS CORPORATION;MCCONNELL JOHN E.;BULTITUDE JOHN;JONES LONNIE;WEBSTER ALAN
发明人
MCCONNELL JOHN E.;BULTITUDE JOHN;JONES LONNIE;WEBSTER ALAN