发明名称 |
CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKS |
摘要 |
A multi-die semiconductor device is disclosed. The device may include one or more first-sized die on a substrate and one or more second-sized die affixed over the one or more first-sized die. The second-sized die may have a larger footprint than the first-sized die. An internal molding compound may be provided on the substrate having a footprint the same size as the second-sized die. The second-sized die may be supported on the internal molding compound. Thereafter, the first and second-sized die and the internal molding compound may be encapsulated in an external molding compound. |
申请公布号 |
US2013015589(A1) |
申请公布日期 |
2013.01.17 |
申请号 |
US201113265662 |
申请日期 |
2011.07.14 |
申请人 |
LIAO CHIH-CHIN;CHIU CHIN-TIEN;YU CHEEMAN;UPADHYAYULA SURESH KUMAR;LI WEN CHENG;LU ZHONG |
发明人 |
LIAO CHIH-CHIN;CHIU CHIN-TIEN;YU CHEEMAN;UPADHYAYULA SURESH KUMAR;LI WEN CHENG;LU ZHONG |
分类号 |
H01L25/065 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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