INSULATION RESIN COMPOSITION, INSULATION RESIN SHEET WITH BASE MATERIAL, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provided an insulation resin composition for a multilayer printed wiring board that has low thermal expansion coefficient and low melting viscosity and is superior in fire resistance; an insulation resin sheet with a base material wherein an insulation layer made of the insulation resin composition is formed on a base material; a multilayer printed wiring board that excels in plating adhesion and insulation reliability; a semiconductor device that is superior in reliability. SOLUTION: The insulation resin composition for a multilayer printed wiring board essentially contains the following elements (A) to (D): (A) a copolymerization epoxy resin of bisphenol A and bisphenol F of which weight ratio is 1/9 to 1/1; (B) a thermosetting resin with softening point of 80°C or below; (C) a curing agent; and (D) an inorganic filler. COPYRIGHT: (C)2008,JPO&INPIT