Transponder inlay and device including such an inlay

摘要

The inlay (10) for the manufacture of a device (12) comprising a base made up of a multilayer structure within which the inlay (10) is designed to be incorporated, the insert (10) comprising a microcircuit and an antenna connected to the microcircuit. The transponder assembly is combined into a microcircuit module (26) and the substrate includes a cavity (28) dimensioned to completely receive the module (26).

主权项

1. A method of making a device comprising a multilayer structure including a transponder, comprising:
a step of preparing a transponder assembly comprising a microcircuit and an antenna connected to the microcircuit, wherein the transponder assembly is combined into a microcircuit module comprising a base having faces bearing the microcircuit and the antenna, the antenna extending in two parts on each of the faces of the base, the base having a thickness between 70 and 100 micrometers, a step, before receiving the transponder assembly, of preparing a substrate having a cavity dimensioned to completely receive the transponder assembly, a step of preparing a transponder inlay by completely receiving the module in the cavity, and a step of incorporating, subsequent to the receiving of the module in the cavity, the transponder inlay within the multilayer structure, the transponder inlay being interleaved between two outside layers, these two outside layers being thickness compensation layers.