| 发明名称 |
ELECTRONIC MODULE |
| 摘要 |
An electronic module is provided, which includes: a substrate; an antenna body disposed over the substrate; and an encapsulant formed on the substrate and encapsulating the antenna body. A portion of the antenna body is exposed from the encapsulant. As such, the invention increases the arrangement area of the antenna body without increasing the size of the substrate, and also reduces the height of the encapsulant. Therefore, the electronic module of the present invention meets the miniaturization requirement. |
| 申请公布号 |
US2016172762(A1) |
申请公布日期 |
2016.06.16 |
| 申请号 |
US201514695469 |
申请日期 |
2015.04.24 |
| 申请人 |
Siliconware Precision Industries Co., Ltd. |
发明人 |
Chiu Chih-Hsien;Shih Chi-Liang |
| 分类号 |
H01Q9/04;H01Q1/38 |
主分类号 |
H01Q9/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic module, comprising:
a substrate; an antenna body disposed over the substrate; and an encapsulant formed on the substrate and encapsulating the antenna body, wherein a portion of the antenna body is exposed from the encapsulant, and the encapsulant has a first surface, a second surface opposite to the first surface and bonded to the substrate, and a side surface adjacent to and connecting the first and second surfaces. |
| 地址 |
Taichung TW |
