| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component and the like with higher connection reliability of a semiconductor device and a wire substrate.SOLUTION: An electronic component according to the present invention includes a first substrate, an electrode located on a first surface of the first substrate, a first resin projection formed on the first surface of the first substrate, a second resin projection formed on the first surface of the first substrate, a first wire connected to the electrode and having a first part covering at least a part of the first resin projection and a second part covering at least a part of the second resin projection, a second substrate, a second wire located on a second surface of the second substrate, and a projection electrode in contact with the second wire of the second substrate and in contact with the first part and the second part. |
