发明名称 Wired circuit board and producing method thererof
摘要 A wired circuit board includes a metal supporting board having at least one depressed portion, a conductive portion embedded in the at least one depressed portion and formed of a material having a higher conductivity than that of the metal supporting board, an insulating layer formed on the metal supporting board so as to cover the conductive portion, and a plurality of wires formed on the insulating layer in mutually spaced-apart relation so as to oppose to the conductive portion.
申请公布号 US8354597(B2) 申请公布日期 2013.01.15
申请号 US20080216511 申请日期 2008.07.07
申请人 NITTO DENKO CORPORATION;YOKAI TAKAHIKO;NAITO TOSHIKI 发明人 YOKAI TAKAHIKO;NAITO TOSHIKI
分类号 H05K1/03;G11B5/48;H05K1/00 主分类号 H05K1/03
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