发明名称 |
Wired circuit board and producing method thererof |
摘要 |
A wired circuit board includes a metal supporting board having at least one depressed portion, a conductive portion embedded in the at least one depressed portion and formed of a material having a higher conductivity than that of the metal supporting board, an insulating layer formed on the metal supporting board so as to cover the conductive portion, and a plurality of wires formed on the insulating layer in mutually spaced-apart relation so as to oppose to the conductive portion.
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申请公布号 |
US8354597(B2) |
申请公布日期 |
2013.01.15 |
申请号 |
US20080216511 |
申请日期 |
2008.07.07 |
申请人 |
NITTO DENKO CORPORATION;YOKAI TAKAHIKO;NAITO TOSHIKI |
发明人 |
YOKAI TAKAHIKO;NAITO TOSHIKI |
分类号 |
H05K1/03;G11B5/48;H05K1/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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