发明名称 Palladium complex and catalyst-imparting treatment solution using the same
摘要 There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I): wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.
申请公布号 US8354014(B2) 申请公布日期 2013.01.15
申请号 US20060096027 申请日期 2006.11.02
申请人 EBARA-UDYLITE CO., LTD.;KOHTOKU MAKOTO;HAMADA MIKA 发明人 KOHTOKU MAKOTO;HAMADA MIKA
分类号 C25D5/56;C23C18/20;C23C18/28;C23C18/30;C23C28/02 主分类号 C25D5/56
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