SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to change the active surface of a semiconductor chip into a face-up form by using a second solder ball, thereby extending input and output pins. CONSTITUTION: A conductive pattern(110a) is formed on a package substrate(110). A cavity(111) is formed at the center of the lower face of the package substrate. A first solder ball(112) is formed on the lower side of the package substrate except for the cavity. A semiconductor chip(120) is arranged in the cavity. A non-active layer(120b) of the semiconductor chip adheres to a non-active layer(111a) of the package substrate. An active surface(120a) of the semiconductor chip is electrically connected to a mounting board(3) through a second solder ball(121).