| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic module arranged so as to sufficiently efficiently use wiring layers except innerlayer wiring layers when forming a circuit on the assumption that there are the innerlayer wiring layers restricted to form a free pattern in a direction of plate extension since components exist in a substrate thickness. <P>SOLUTION: The number of wiring layers existing between internal layer wiring layers including innerlayer wiring layers 22, 23, 24, 25 and 26 with mounted components except incomplete innerlayer wiring layers and outer layer wiring layers including outer layer wiring layers 21 and 27 on sides with surface mounted components is more than that of wiring layers existing between innerlayer wiring layers without including the innerlayer wiring layers with mounted components and the outerlayer wiring layers including an outerlayer wiring layer on a side with external connection terminals except the incomplete innerlayer wiring layers. <P>COPYRIGHT: (C)2013,JPO&INPIT |
