发明名称 |
SEMICONDUCTOR CARRIER, PACKAGE AND FABRICATION METHOD THEREOF |
摘要 |
A semiconductor package includes: a first encapsulant having tapered through holes each having a wide top and a narrow bottom; tapered electrical contacts disposed in the tapered through holes; circuits disposed on a top surface of the first encapsulant and each having one end connecting one of the electrical contacts and the other end having a bonding pad disposed thereon such that the bonding pads are circumferentially arranged to define a die attach area on the top surface of the first encapsulant. As such, a semiconductor chip can be disposed on the top surface of the first encapsulant in the die attach area and electrically connected to the bonding pads through conductive elements, and further a second encapsulant encapsulates the semiconductor chip, the conductive elements, the circuits and the first encapsulant so as to prevent falling off of the electrical contacts and reduce the length of the conductive elements.
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申请公布号 |
US2013009311(A1) |
申请公布日期 |
2013.01.10 |
申请号 |
US201113308938 |
申请日期 |
2011.12.01 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD.;LIN PANG-CHUN;TSAI YUEH-YING;CHEN YONG-LIANG |
发明人 |
LIN PANG-CHUN;TSAI YUEH-YING;CHEN YONG-LIANG |
分类号 |
H01L23/498;H01L21/56;H01L21/60;H01L21/78 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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