| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive type photoresist composition having high sensitivity and few developing defects. <P>SOLUTION: The positive type photoresist composition contains a resin which is dissolved by the action of acid and of which resin the solubility in an alkalyne developing liquid is increased, an oxim sulfonate compound and a compound having a phenacyl sulfonium salt structure as compounds which generate the acid with an irradiation of activating light or a radioactive ray. <P>COPYRIGHT: (C)2004,JPO |
