发明名称 |
SOLID-STATE IMAGE SENSING APPARATUS AND ELECTRONIC APPARATUS |
摘要 |
A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.
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申请公布号 |
US2013010145(A1) |
申请公布日期 |
2013.01.10 |
申请号 |
US201213530746 |
申请日期 |
2012.06.22 |
申请人 |
SONY CORPORATION;HAGIWARA HIROKI;SASANO KEIJI;TANAKA HIROAKI;TUJI YUKI;WATANABE TSUYOSHI;TSUCHIYA KOJI;TANAKA KENZO;WADA TAKAYA;KAWABATA NOBORU;YOSHIDA HIROKAZU;YOKOYAMA HIRONORI |
发明人 |
HAGIWARA HIROKI;SASANO KEIJI;TANAKA HIROAKI;TUJI YUKI;WATANABE TSUYOSHI;TSUCHIYA KOJI;TANAKA KENZO;WADA TAKAYA;KAWABATA NOBORU;YOSHIDA HIROKAZU;YOKOYAMA HIRONORI |
分类号 |
H04N5/225 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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