| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processing method that eliminates the needs of setting bending conditions and newly producing a bending device when a specification of a substrate is changed, and realizes high-quality bending. <P>SOLUTION: A processing method of a flexible substrate for bending a COF substrate at an arbitrary angle includes: a step S1 that is a bending property examination step for examining, on the basis of a cross-sectional area ratio between a base material and wirings of the COF substrate, the relationship between the cross-sectional area ratio and a bending angle of the flexible substrate; a step S2 that is a cross-sectional area ratio determination step for determining the cross-sectional area ratio of the COF substrate; and a step S3 that is a designing step for designing the COF substrate having the cross-sectional area ratio corresponding to the bending angle. <P>COPYRIGHT: (C)2013,JPO&INPIT |
