| 摘要 |
There are preliminarily prepared element characteristic information 12 that is obtained by individually, previously measuring emission characteristics of a plurality of LED elements and resin coating information 14 that makes a coating quantity of resin appropriate for obtaining an LED package exhibiting a specified emission characteristic correlated with the element characteristic information. A map preparation processing section 74 prepares, for each substrate, map data 18 that correlate mounting position information 71a showing positions of LED elements mounted on the substrate by a component mounting device M1 with the element characteristic information 12. An emission characteristic inspection device M7 inspects finished products coated with a resin, and inspection results are fed back to the resin coating device M4. Resin coating information M14 is updated according to the inspection results.
|
