发明名称 TRANSCEIVER AND INTERFACE FOR IC PACKAGE
摘要 An interconnect system includes a first circuit board (18), first (14) and second (18a) connectors connected to the first circuit board (18), and a transceiver (15) including an optical engine (15a) and arranged to receive and transmit electrical and optical signals through a cable (16), to convert optical signals received from the cable (16) into electrical signals, and to convert electrical signals received from the first connector (14) into optical signals to be transmitted through the cable (16). The transceiver (15) is arranged to mate with the first (14) and second (18a) connectors so that at least some converted electrical signals are transmitted to the first connector (14) and so that at least some electrical signals received from the cable (16) are transmitted to the second connector (18a).
申请公布号 WO2013006499(A2) 申请公布日期 2013.01.10
申请号 WO2012US45127 申请日期 2012.06.29
申请人 SAMTEC, INC.;ZBINDEN, ERIC;MUSSER, RANDALL;VERDIELL, JEAN-MARC ANDRE;MONGOLD, JOHN;VICICH, BRIAN;GUETIG, KEITH 发明人 ZBINDEN, ERIC;MUSSER, RANDALL;VERDIELL, JEAN-MARC ANDRE;MONGOLD, JOHN;VICICH, BRIAN;GUETIG, KEITH
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