发明名称 Semiconductor integrated circuit and method for fabricating the same
摘要 A semiconductor integrated circuit includes: a semiconductor chip; a through-chip via passing through a conductive pattern disposed in the semiconductor chip and cutting the conductive pattern; and an insulation pattern disposed on an outer circumference surface of the through-chip via to insulate the conductive pattern from the through-chip via.
申请公布号 US8350362(B2) 申请公布日期 2013.01.08
申请号 US20100831341 申请日期 2010.07.07
申请人 HYNIX SEMICONDUCTOR INC.;BYEON SANG-JIN;CHOI JUN-GI 发明人 BYEON SANG-JIN;CHOI JUN-GI
分类号 H01L29/40 主分类号 H01L29/40
代理机构 代理人
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