发明名称 COATING FILM FORMING METHOD AND COATING FILM FORMING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a coating film forming method capable of controlling a thickness of a coating film in an outer periphery of a substrate and enlarging an effective region of the substrate. <P>SOLUTION: A coating film forming method of an embodiment includes the steps of: rotating a substrate (S102); supplying a chemical for coating film formation onto a rotating substrate (S104); and supplying a liquid whose temperature is lower than an atmospheric temperature of the substrate from a rear surface side of the substrate to an end part of the substrate while forming a film by supplying the chemical onto the rotating substrate (S106). <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013004614(A) 申请公布日期 2013.01.07
申请号 JP20110132326 申请日期 2011.06.14
申请人 TOSHIBA CORP 发明人 ORI TOMOYA
分类号 H01L21/027;B05C11/08;B05D1/40 主分类号 H01L21/027
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