| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flexible printed wiring board including conductive layers formed in a plurality of layers and electrically connected (interlayer conduction) each other, capable of improving electrical connection reliability and manufacturing efficiency and also achieving reduced wall thickness, and a method for manufacturing the flexible printed wiring board. <P>SOLUTION: In a flexible printed wiring board 100, conductive layers 2 stacked on the front and back sides of a base material layer 1 are electrically connected each other via a plating layer 3 provided at a through hole T penetrating through the front and back conductive layers 2 and the base material layer 1. The through hole T has such a level difference that a hole diameter of the through hole T is narrowed at between the base material layer 1 and the conductive layer 2 stacked on one of the front side and the back side of the base material layer 1. The plating layer 3 is provided: at a fringing part of an opening of the through hole T on at least a side where the level difference is not present; and on an inner hole surface of the through hole T including a part of the level difference. <P>COPYRIGHT: (C)2013,JPO&INPIT |
