| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a thin solar cell exhibiting high cutting yield when forming a thin substrate. <P>SOLUTION: A strained layer 202 is formed at a position deeper than the surface of a silicon ingot 201, an H element implantation layer 203 is formed at a position near a strain injection region, and a vacancy layer 204 caused by the H element is formed near the strained layer 202 by heating treatment. A vacancy layer of good quality can be formed by separating a thin silicon substrate 205 from the silicon ingot 201 by thermal shock, and a high cutting yield where the percentage defective is about 50% or lower can be ensured when separating or cutting a substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
