| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board that is enhanced in reliability by suppressing increase of via resistance and occurrence of dispersion of via resistance even when vias are designed to be fine (small in diameter and short in distance between adjacent vias). <P>SOLUTION: A wiring board has a core board portion having a first wire formed on the surface layer thereof, a second wire laminated on the core board portion through an insulating layer formed of hardened material of prepreg, and via paste 110 which is filled in a hole formed in the insulating layer and electrically connects the first wire and the second wire. The via paste 110 has first and second potential hardening agents 140, 150, unhardened resin mixture 130 which is hardened by the potential hardening agents, and electrically conductive particles 120. The softening temperatures of the first and second potential hardening agents 140, 150 are not less than 40°C and not more than 200°C, and are different from each other in the range from 10°C to 140°C. <P>COPYRIGHT: (C)2013,JPO&INPIT |
