发明名称 MODULAR PANEL FOR THERMAL ENERGY TRANSFER
摘要 <p>A modular panel for thermal energy transfer particularly configured for being used in ceilings and walls, comprising a heat-insulating layer (2) forming a supporting structure demarcated by a lower face (2A), an upper face (2B), two side faces (2C, 2D) and two end faces (2E, 2F). Said panel (1) comprises at least one conducting plate (3) attached to the lower face (2A). Said conducting plate (3) is formed by a groove (31) embedded in the heat-insulating layer (2), defining a longitudinal cavity (32) which is configured to house a hydraulic pipe (6), and defining a longitudinal opening (34) which allows inserting the hydraulic pipe (6); a transfer plate (35) extending on the lower face (2A) and closure means (4) configured to seal the longitudinal opening (34) and press the hydraulic pipe (6) against the groove (31).</p>
申请公布号 CA2840790(A1) 申请公布日期 2013.01.03
申请号 CA20112840790 申请日期 2011.06.30
申请人 TARRAGA SANCHEZ, ENRIQUE;JORDAN FERNANDEZ, LUIS;CORTINAS MUNOZ, JAUME 发明人 TARRAGA SANCHEZ, ENRIQUE;JORDAN FERNANDEZ, LUIS;CORTINAS MUNOZ, JAUME
分类号 E04B5/48;E04C2/52;F24D3/14;F24F5/00 主分类号 E04B5/48
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