发明名称 |
Defect Detection by Thermal Frequency Imaging |
摘要 |
A method can be used for detecting defects in an electronic integrated circuit that includes a power input and a data input. The electronic integrated circuit is powered with a periodic power signal having a frequency and an input signal is applied to the data input. A surface of the electronic integrated circuit is swept with a laser beam. A first image is generated using a laser beam reflected from the surface and a second image is generated using a selected part of the laser beam reflected from the surface. The selected part of the reflected laser beam has a frequency that corresponds to the frequency of the power signal. Defects in the integrated circuit can be detected by superposing the first image and the second image.
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申请公布号 |
US2013002283(A1) |
申请公布日期 |
2013.01.03 |
申请号 |
US201213568020 |
申请日期 |
2012.08.06 |
申请人 |
STMICROELECTRONICS SA;CELI GUILLAUME;PARRASSIN THIERRY;DUDIT SYLVAIN |
发明人 |
CELI GUILLAUME;PARRASSIN THIERRY;DUDIT SYLVAIN |
分类号 |
G01R31/311 |
主分类号 |
G01R31/311 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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