| 摘要 |
<p>A thermosetting resin composition comprising a polyimide resin (A) and a boron compound (B) represented by general formula (b3) below, wherein the polyimide resin (A) is a polyimide resin having a divalent structural unit represented by general formula (a1) below
in the formula (b3), R 3 's each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms; and Z represents a nitrogen-containing heterocyclic compound.</p> |
