Edge-exclusion spalling method for removing substrate material

摘要

A method to minimize edge-related substrate breakage during spalling using an edge-exclusion region (14) where the stressor layer (16) is either non-present (excluded either during deposition or removed afterwards) or present but significantly non-adhered to the substrate surface in the exclusion region is provided. In a preferred embodiment of the present invention, the method includes forming an edge exclusion material (14) on an upper surface and near an edge of a base substrate (10â â ). A stressor layer (16) is then formed on exposed portions of the upper surface of the base substrate (10â â ) and atop the edge exclusion material (14). A portion (10â ) of the base substrate that is located beneath the stressor layer and which is not covered by the edge exclusion material is then spalled and separated from the bulk of the substrate. The material is removed from the substrate by stresses caused by the stressor layer. An adhesive layer (15) can be formed between the substrate and stressor layer. This method improves the reusability of the substrate.