NOVEL COMPOUND

摘要

Provided is a novel compound suitable for obtaining a negative-type photosensitive resin composition capable of forming a pattern having excellent adhesiveness at low light exposure. This compound is indicated by formula (1). In the formula, R1 and R2 each independently indicate a hydrogen atom or an organic group, but at least one indicates an organic group. R1 and R2 may bond and form an annular structure and may also contain a hetero atom bond. R3 indicates a single bond or an organic group. R4-R9 each independently indicate a hydrogen atom, an organic group, etc., but R6 and R7 are never hydroxyl groups. R10 indicates a hydrogen atom or an organic group.