| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copper plating method that can deposit an even and smooth copper plating film with a preferable mirror gloss even when forming a relatively thin copper plating film. <P>SOLUTION: The copper plating method includes: bringing an object to be plated into contact with a pre-treatment solution containing a bromide ion; and depositing copper by electroplating, using a copper plating solution. <P>COPYRIGHT: (C)2013,JPO&INPIT |
