| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a resin composition for a plating resist, useful for forming a partial through hole; and a multilayer printed wiring board having a partial through hole formed by dividing a through hole using the composition. <P>SOLUTION: A resin composition for a plating resist is used as a part of an interlayer insulation layer of a multilayer printed wiring board comprising the interlayer insulation layer and a conductive layer which are alternately laminated, and includes 30-90 mass% of a titanium oxide relative to a resin solid content. <P>COPYRIGHT: (C)2013,JPO&INPIT |
