发明名称 |
COMPOSITION OF SOLID-CONTAINING PASTE |
摘要 |
<p>Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the changes of metal to metal contact between the surfaces of the solder balls and other surfaces that the solder balls come into contact with. The solder paste also includes solder balls of different average sizes, that improves the desirable liquid like properties of the granular paste while further reducing viscosity. As such, the solder paste is used in current screen printing solder paste application methods without the risk of clogging or agglomeration of solder paste particles on surfaces. The solder paste is also used in jetting or dispensing solder paste application methods without the risk of clogging or agglomeration within the cylinders/containers or apertures and nozzles that are used within such methods.</p> |
申请公布号 |
WO2012150105(A9) |
申请公布日期 |
2012.12.27 |
申请号 |
WO2012EP56229 |
申请日期 |
2012.04.04 |
申请人 |
MICRONIC MYDATA AB;SANDSTROEM, TORBJOERN |
发明人 |
SANDSTROEM, TORBJOERN |
分类号 |
B23K35/02;B23K35/36;B23K35/362 |
主分类号 |
B23K35/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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