| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrochemical device for preventing a part where a via conductor portion is provided from being broken by stress generated owing to thermal expansion and contraction accompanying temperature variation in reflow soldering, temperature variation after mounting, etc., even when the via conductor portion is used for a lead-out conductor. SOLUTION: A first lead-out conductor 50 includes a via conductor portion 52 along the thickness direction of a plate-like portion 22 (upper layer 22a), and the via conductor portion 52 is provided shifting in position from the center of the plate-like portion 22. Namely, the via conductor portion 52 is provided avoiding the center CT of the plate-like portion 22 where the stress generated owing to the thermal expansion and contraction accompanying the temperature variation in reflow soldering, temperature variation after mounting, etc., is apt to concentrate, so even if the stress generated owing to the thermal expansion and contraction is applied to the plate-like portion 22, the risk that the part of the plate-like portion 22 where the via conductor portion 52 is provided is broken by the stress is securely eliminated. COPYRIGHT: (C)2010,JPO&INPIT |
