| 摘要 |
Provided is a communication apparatus including a substrate, a high-frequency coupling device including a coupling electrode and a ground formed as a conductive pattern on the substrate, a communication circuit unit configured to process a high-frequency signal transmitted and received by the coupling electrode, and a resonant unit configured to increase an amount of electric current flowing into the coupling electrode. The high-frequency coupling device is configured such that a longitudinal length is shorter than a lateral length. |
