发明名称 COMPOSITE RESIN COMPOSITION AND MOLDING EXCELLENT IN HEAT DISSIPATION PROPERTY
摘要 <P>PROBLEM TO BE SOLVED: To provide a composite resin composition which is more excellent in molding processability, lightweight properties, and heat radiation properties than a metal material and more excellent in thermal conductivity and mechanical strength than a resin material. <P>SOLUTION: The composite resin composition includes (A) heat conductive fibers and (B) resin as constituent materials. In the composite resin composition, thermal conductivity in a planar direction measured based on the laser flash method in a molded article obtained by molding the resin composition is 5 W/mK or more, the thermal conductivity in the thickness direction is a half or less the thermal conductivity in the planar direction, the bending strength measured based on JIS K 6911 is &ge;80 MPa, and the bending elastic modulus is &ge;8 GPa, the specific gravity is &ge;1 and &le;5 measured based on JIS K 6911, and the linear expansion coefficient in the planar direction is &ge;0.1 ppm/&deg;C and &le;50 ppm/&deg;C. The molding excellent in heat conductivity is produced by using the composite resin composition. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012251144(A) 申请公布日期 2012.12.20
申请号 JP20120108675 申请日期 2012.05.10
申请人 SUMITOMO BAKELITE CO LTD 发明人 ANADA KOHEI;KIMURA YASUTAKA
分类号 C08L101/00;C08J3/02;C08K3/00;C08K7/06 主分类号 C08L101/00
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