发明名称 |
POWER MODULE PACKAGE AND SYSTEM MODULE HAVING THE SAME |
摘要 |
Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.
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申请公布号 |
US2012319260(A1) |
申请公布日期 |
2012.12.20 |
申请号 |
US201213484160 |
申请日期 |
2012.05.30 |
申请人 |
KIM KWANG SOO;LEE YOUNG KI;CHOI SEOG MOON;PARK SUNG KEUN;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM KWANG SOO;LEE YOUNG KI;CHOI SEOG MOON;PARK SUNG KEUN |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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