发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD |
摘要 |
A semiconductor device and manufacturing method. One embodiment provides a semiconductor chip. An encapsulating material covers the semiconductor chip. A metal layer is over the semiconductor chip and the encapsulating material. At least one of a voltage generating unit and a display unit are rigidly attached to at least one of the encapsulating material and the metal layer.
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申请公布号 |
US2012319304(A1) |
申请公布日期 |
2012.12.20 |
申请号 |
US201213595049 |
申请日期 |
2012.08.27 |
申请人 |
PRESSEL KLAUS;BEER GOTTFRIED;INFINEON TECHNOLOGIES AG |
发明人 |
PRESSEL KLAUS;BEER GOTTFRIED |
分类号 |
H01L29/02;H01L21/56 |
主分类号 |
H01L29/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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