| 发明名称 |
CIRCUIT BOARD, MANUFACTURING METHOD OF CIRCUIT BOARD, AND SOLAR CELL MODULE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable easy manufacturing and achieve the durability and the reliability even when multiple metal electrodes are formed by cutting metal foil in a circuit board. <P>SOLUTION: A circuit board 2 includes: a base material 3; multiple adhesion layers 4 formed on a base material surface 3a of the base material 3 so as to be spaced away from each other; and metal electrodes 5, each of which is formed at each adhesion layer 4. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2012253275(A) |
申请公布日期 |
2012.12.20 |
| 申请号 |
JP20110126519 |
申请日期 |
2011.06.06 |
| 申请人 |
TOPPAN PRINTING CO LTD |
发明人 |
KUDO SHIGEKI;KAWASAKI MINORU;KUMAI KOICHI |
| 分类号 |
H01L31/042 |
主分类号 |
H01L31/042 |
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